Company Dynamic - Global Supplier of Sputtering Targets and Evaporation Materials

August 14, 2018Sputter TargetsBlog, evaporation materials0

Preparation and application of aluminum thin films

Common metal materials (such as low carbon steel, metal uranium, etc.) are very reactive and prone to corrosion and performance degradation. Therefore, people have been working on the research and preparation of anti-corrosion films for steel materials. Applying a relatively thin protective film on the surface of the metal material, such as aluminum, zinc, magnesium...

August 9, 2018Sputter TargetsBlog, sputtering technology0

Main factors affecting the voltage of magnetron sputtering

Target magnetic field The cathode operating voltage of magnetron sputtering decreases as the target surface magnetic field increases, and also decreases as the sputtering etch groove of the target surface deepens. The sputtering current increases as the sputter etch bath of the target surface deepens because the sputter etched surface of the target gets closer...

August 8, 2018Sputter TargetsBlog, Ceramics0

An overview of Ceramics

Introduction Ceramic is the general term for pottery and porcelain. The components of the ceramic material are mainly silicon oxide, aluminum oxide, potassium oxide, sodium oxide, calcium oxide, magnesium oxide, iron oxide, titanium oxide and etc. Common ceramic raw materials are clay, quartz, potassium sodium feldspar and etc. They generally have higher hardness but poor...

August 6, 2018Sputter TargetsBlog, Target Materials0

Preparation of CIGS absorber layer

1. Preparation of CuIn film by magnetron sputtering In order to accurately control the element ratio of Cu/In, CuIn film is prepared by co-sputtering method. That is, the CuIn alloy target and the In elemental target are simultaneously sputtered in the same sputtering chamber. The distribution of Cu/In content has a great influence on the...

August 3, 2018Sputter TargetsBlog, sputtering technology0

Advantages and disadvantages of ion beam sputtering

Ion beam sputtering is a thin film process technology that uses an ion source to sputter a target onto a substrate. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control the thickness of the substrate. Its main advantages and disadvantages are as follows: Advantages Sputter coating utilizes momentum exchange...

August 1, 2018Sputter TargetsBlog, sputtering technology0

Five sputter coating technologies

Unbalanced magnetron sputtering If the magnetic fluxes of the inner and outer magnetic pole sections of the cathode by magnetron sputtering are not equal, it is called an unbalanced magnetron sputtering cathode. The magnetic field of the common magnetron sputtering cathode is concentrated near the target surface; the magnetic field of the unbalanced magnetron sputtering...

1 2 3 4