Semiconductor materials can be divided into wafer materials and packaging materials. Compared with wafer manufacturing materials, packaging materials have relatively low technical barriers, so we mainly talk about wafer manufacturing materials. The production of wafer mainly involves 7 kinds of semiconductor materials and chemicals, each of which accounts for the following proportion in the semiconductor...Continue Reading

Titanium targets are widely used in decorative coatings, wear-resistant coatings, electronic industries such as CD, VCD, and all kinds of magnetic disk coating. Tungsten titanium (W-Ti) films and tungsten titanium (W-Ti) based alloy films are high-temperature alloy films, which possess a series of irreplaceable good properties. Tungsten has the high melting point, high strength, and...Continue Reading

As we all know, the technological development trend of the target material is closely related to the development trend of the film technology in the downstream application industry. With the technology improvement of the film products or components of the application industry, the target technology should also be changed. For example, Ic manufacturers, which have...Continue Reading

In modern life, people can not get away from sputtering targets at all times. Smartphones, credit cards, cameras, two generation ID cards… They all have a chip. The ultra-thin metal wire, which is nearly 10000 meters in length, is made of the sputtering target. High purity sputtering target is a key material in semiconductor chip...Continue Reading

Stanford Advanced Materials supplies a variety of high quality elemental and composite evaporation materials (Evaporation Pellets) in a full range of purities and dimensions to suit any customer needs. With more than 15 years experience in this field, we are, as always, dedicating ourselves to improving the quality of our products and service. We have...Continue Reading

[kc_row use_container=”yes” force=”no” column_align=”middle” video_mute=”no” _id=”478784″][kc_column width=”12/12″ video_mute=”no” _id=”243070″][kc_column_text] Our ISO 9001-certified Materials Division stocks a vast assortment of high-purity materials, evaporation sources, and crucible liners for use in both thermal and E-beam evaporation as well as sputter deposition processes. We offer pure elements, compounds, alloys, ceramics, intermetallics, and mixtures in a variety of shapes, sizes, and purities...Continue Reading

Material Safety Data Sheets (MSDS) – Page 18 Sputtering Target Formula CAS Number Available Purities MSDS File Barium Sulfide BaS 21109-95-5 99.9% Bismuth Sulfide Bi2S3 1345-07-9 99.9%, 99.95%, 99.99% Cadmium Sulfide CdS 1306-23-6 99.9%, 99.95%, 99.99%, 99.995%, 99.999% Calcium Sulfide CaS 20548-54-3 99.9%, 99.95% Chromium Sulfide Cr2S3 12018-22-3 99.9% Copper Sulfide CuS 1317-40-4 99.9%, 99.95%...Continue Reading

Material Safety Data Sheets (MSDS) – Page 15 Sputtering Target Formula CAS Number Available Purities MSDS File Iron Carbide Fe3C 12011-67-5 99.9% Niobium Carbide NbC 12069-94-2 >99.5% Molybdenum Carbide Mo2C 12069-89-5 99.5% Silicon Carbide SiC 409-21-2 99.5% Tantalum Carbide TaC 12070-06-3 99.5% Titanium Carbide TiC 12070-08-5 99.5% Tungsten Carbide WC 12070-12-1 99.5%, 99.9% Vanadium Carbide...Continue Reading

Material Safety Data Sheets (MSDS) – Page 14 Sputtering Target Formula CAS Number Available Purities MSDS File Aluminum Nitride AlN 24304-00-5 99.5%, 99.9% Chromium Nitride Cr2N 12053-27-9 99.5%, 99.9% Boron Nitride BN 10043-11-5 >99.5% Germanium Nitride Ge3N4 12065-36-0 99.9% Iron Nitride FeN4 37245-77-5 99.9% Hafnium Nitride HfN 25817-87-2 >99.5% Niobium Nitride NbN 24621-21-4 >99.5% Silicon...Continue Reading