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Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. We update every week about news and knowledge of sputtering targets and evaporation materials. Here are the blogs we published previously.

sputtering target for electronics

Types and Applications of Sputtering Targets in the Electronic Industry

Sputtering targets have important applications in many areas, such as architecture, optics, electronics and so on. Sputtering targets used in electronic industry can be subdivided into semiconductor target (also called anelva target), planar target, coated glass target, solar photovoltaic target, and so on. There are some differences in the selection and performance requirements of sputtering materials in different application fields....
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How is the Semiconductor Wafer Manufactured? (With Infographic)

Semiconductor wafers are the basic material for manufacturing electronic chips. The most important raw material for semiconductor integrated circuits is silicon, which is widely found in rocks and gravels in the form of silicates or silica in nature. The fabrication process of semiconductor silicon wafers can be divided into three basic steps: silicon purification and...
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What Are the Applications of Sputtering Targets? (With Video)

Sputtering targets are a physical vapor deposition (PVD) mechanism with many uses in modern technology and manufacturing. In the sputtering process, the atoms are pulled from the sputter target with powerful magnets, and a controlled gas (usually argon) is introduced. Then, the processed to collide with each other in their gaseous state before condensing into...
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Common Defects in Physical Vapor Deposition

20 Common Defects in Physical Vapor Deposition

Due to their excellent wear resistance, heat resistance and other properties, PVD coatings are widely used in various industries. However, the defects of the coating make it impossible to demonstrate all of its advantages. If you want to solve the defects in PVD coating, you must know these defects, at least you should know – what...
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What is Physical Vapor Deposition

What is Physical Vapor Deposition (PVD)?

What is PVD Coating Technology? Physical Vapor Deposition (PVD) is a thin film preparation technique that physically vaporizes the surface of a material source (solid or liquid) into gaseous atoms, molecules or partially ionized into ions under vacuum conditions. Then, a film having a specific function is deposited on the surface of the substrate by...
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everything about titanium sputtering target

Everything You Need to Know About Titanium Sputtering Target

Metal titanium and titanium sputtering target are essentially the same, both of which are composed of titanium element; the difference is that metal titanium is more like a raw material, and titanium target is more like a titanium product. Titanium as a raw material can be made into titanium sputtering targets by several methods, and...
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5 Sputter Coating Methods (That Prepare Good Quality Film)

Unbalanced magnetron sputtering Unbalanced magnetron sputtering uses unbalanced magnetron sputtering cathode, which refers to the unequal magnetic fluxes of the inner and outer magnetic pole sections of the cathode. The effect of the unbalanced magnetic field is to trap fast moving secondary electrons that escape from the target surface. These electrons undergo ionizing collisions with...
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Advantages and Disadvantages of Ion Beam Sputtering

Ion Beam Sputtering Definition Ion beam sputtering (IBS), or ion beam deposition (IBD), is a thin film deposition technology that uses an ion source to deposit a sputtering target onto a substrate to produce the highest quality films with excellent precision. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control...
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