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(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0941 Nickel Antimonide Sputtering Target, NiSb

Chemical Formula NiSb
Catalog No. ST0941
CAS Number 12035-52-8
Purity 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape Discs, Plates, Column Targets, Step Targets, Custom-made

The Nickel Antimonide Sputtering Target is available in various forms, purities, sizes, and prices. Stanford Advanced Materials (SAM) is a trusted industry leader with a proven track record in delivering high-purity Nickel Antimonide Sputtering Targets at competitive prices.


Nickel Antimonide Sputtering Target Description

Nickel Antimonide Sputtering Target is a specialized material used in the sputtering process for thin film deposition. Nickel antimonide is a semiconductor material. Thin films of NiSb deposited using sputtering targets can be used in various semiconductor applications.

Stanford Advanced Materials (SAM) specializes in creating Nickel Antimonide Sputtering Targets with optimal density and minimal average grain size. By utilizing the sputtering technique, we can deposit ultra-high purity thin films of sputtered metal or oxide materials onto a solid substrate. The exceptional purity of our targets ensures the superior quality and performance of the resulting film.

Related Product: Nickel Silicide Sputtering Target, Nickel Oxide Sputtering Target

Nickel Antimonide Sputtering Target Specifications

Compound Formula NiSb
Molecular Weight 180.45
Appearance gray target
Melting Point 1102℃
Density 8.56 g/cm3
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Nickel Antimonide Sputtering Target Handling Notes

  1. Indium bonding is recommended for Nickel Antimonide Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
  2. This material has a low thermal conductivity and is susceptible to thermal shock.

Nickel Antimonide Sputtering Target Application

  • Semiconductor Devices: Used in the fabrication of electronic components like transistors and diodes.
  • Thermoelectric Devices: Applied in devices for converting heat energy into electrical energy.
  • Magnetic Devices: Nickel antimonide’s potential magnetic properties may be utilized in magnetic devices or spintronics.
  • Research and Development: Employed in R&D to explore emerging technologies and novel electronic devices.
  • Optoelectronics: Depending on film properties, NiSb may find use in optoelectronic devices like photodetectors or LEDs.

Nickel Antimonide Sputtering Target Packaging

Our Nickel Antimonide Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.

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SAM’s Nickel Antimonide Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.

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Nickel Antimonide Sputtering Target, NiSb
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