Chemical Formula: Ti
Catalog Number: ST0405
CAS Number: 7440-32-6
Purity: 99.9%-99.999%
Thermal Conductivity: 21.9 W/m.K
Melting Point (°C): 1,660
Coefficient of Thermal Expansion: 8.6 x 10-6/K
| OD | ID | L | |
| Dimension | 5.5”-7” | 5”-5.5” | <138” |
Titanium is a chemical element originated from Titans, the sons of the Earth goddess of Greek mythology. It was first mentioned in 1791 and observed by W. Gregor. The isolation was later accomplished and announced by J. Berzelius. “Ti” is the canonical chemical symbol of titanium. Its atomic number in the periodic table of elements is 22 with location at Period 4 and Group 4, belonging to the d-block. The relative atomic mass of titanium is 47.867(1) Dalton, the number in the brackets indicating the uncertainty.
Related Product: Titanium (Ti) Sputtering Target
Related Post: How was titanium discovered? | History of Titanium
Comparing with planar targets, rotatory target contains more material and offers a greater utilization, which means longer production runs and reduced downtime of the system, increases the throughput of the coating equipment. Besides, rotatory sputtering target allows the use of higher power densities due to the heat build-up being spread evenly over the surface area of the target. As a consequence, an increased deposition speed can be seen along with an improved performance during reactive sputtering.
Our materials are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.
Stanford Advanced Materials specializes in producing high purity Rotatory Titanium sputtering targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.
