ST0494 Copper Tin (Cu/Sn) Sputtering Target

Description of Copper Tin Sputtering Target

Copper is a chemical element originated from the Old English name coper in turn derived from the Latin ‘Cyprium aes’, meaning a metal from Cyprus. It was early used in 9000 BC and discovered by people from the Middle East. “Cu” is the canonical chemical symbol of copper. Its atomic number in the periodic table of elements is 29 with location at Period 4 and Group 11, belonging to the d-block. The relative atomic mass of copper is 63.546(3) Dalton, the number in the brackets indicating the uncertainty.

Tin, also called stannum, is a chemical element originated from the Anglo-Saxon word tin (stannum in Latin, meaning hard). It was early used in 3500 BC. “Sn” is the canonical chemical symbol of tin. Its atomic number in the periodic table of elements is 50 with location at Period 5 and Group 14, belonging to the p-block. The relative atomic mass of tin is 118.710(7) Dalton, the number in the brackets indicating the uncertainty.

Related Products: Copper sputtering target, Tin sputtering target.

Specifications of Copper Tin Sputtering Target

We also offer other customized shapes and sizes of the sputtering targets, please send us an inquiry for more information.

Packing

Our Copper Tin sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

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SAM’s Copper Tin sputter targets are available in various forms, purities, sizes, and prices. We specialize in producing high purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Get an inquiry right now.