| Chemical Formula | Ag/Cu |
| Catalog No. | ST0905 |
| CAS Number | 12249-45-5 |
| Purity | 99.9%, 99.95%, 99.99%, 99.995%, 99.999% |
| Shape | Discs, Plates, Column Targets, Step Targets, Custom-made |
The Silver Copper Sputtering Target is available in various forms, purities, and sizes. Stanford Advanced Materials (SAM) offers high-quality Silver Copper Sputtering Targets at the most competitive prices.
Silver Copper Sputtering Target is a material designed for use in a process called sputter deposition. Sputter deposition is a technique used to deposit thin films onto substrates in various industries, including electronics, optics, and solar cells. The process involves bombarding a sputtering target with high-energy ions, causing atoms or molecules to be ejected from the target material and then deposited onto a substrate to form a thin film.
Related Product: Silver Sputtering Target, Copper Sputtering Target
| Compound Formula | Ag/Cu |
| Molecular Weight | 171.41 |
| Appearance | Yellowish to silvery metallic solid |
| Melting Point | 779-900℃ |
| Density | 9.7-10.4 g/cm3 |
| Available Sizes | Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Silver Copper Sputtering Target allows for the creation of thin films with tailored electrical and conductive properties. This type of sputtering target finds applications in the production of conductive layers in electronic devices, such as semiconductors, sensors, and thin-film solar cells.
Our Silver Copper Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.
SAM’s Silver Copper Sputtering Targets are available in various forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) display and optical applications.
