(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0997 Nickel Gallium Sputtering Target, Ni/Ga

Chemical Formula Ni/Ga
Catalog No. ST0997
CAS Number
Purity 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape Discs, Plates, Column Targets, Step Targets, Custom-made

Stanford Advanced Materials (SAM) offers high-purity Nickel Gallium Sputtering Targets at competitive prices. With extensive materials science expertise, SAM delivers top-notch targets for nanotechnology and thin-film deposition, meeting stringent industry standards. Achieve precise and reliable film deposition with our exceptional quality targets.


Nickel Gallium Sputtering Target Description

Nickel Gallium Sputtering Target is a crucial component in thin-film deposition processes. Composed of a high-purity alloy of nickel and gallium, this target possesses exceptional properties that make it highly sought after. It exhibits remarkable thermal stability, ensuring consistent performance even under demanding conditions. With its high electrical conductivity, it enables efficient electron transfer, making it ideal for applications in semiconductor manufacturing and electronic device fabrication. Moreover, the Nickel Gallium Sputtering Target offers excellent adhesion to substrates, resulting in durable and reliable thin films. Its versatility makes it suitable for various industries, including optical coatings and magnetic storage devices. By utilizing this target, precise and uniform film deposition is achieved, leading to the production of high-performance electronic and optical devices.

Related Product: Aluminum Nickel Sputtering Target, Chromium Nickel Sputtering Target

Nickel Gallium Sputtering Target Specifications

Compound Formula Ni/Ga
Appearance Silver Grey Target
Density 8.53-8.99 g/cm3
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Nickel Gallium Sputtering Target Handling Notes

  1. Indium bonding is recommended for the Nickel Gallium Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
  2. This material has a low thermal conductivity and is susceptible to thermal shock.

Nickel Gallium Sputtering Target Application

  1. Semiconductor Manufacturing: The Nickel Gallium Sputtering Target plays an important role in semiconductor manufacturing. It can be used to prepare metal oxide films, metal stacked structures and conductive layers for the manufacture of transistors, capacitors and other electronic devices.
  2. Optical Coatings: This material is used to prepare optical coatings such as mirrors, filters and optical lenses. It has excellent optical properties and high reflectivity and can be used to improve the efficiency and performance of optical devices.
  3. Magnetic memory devices: The Nickel Gallium Sputtering Target plays a key role in the preparation of magnetic memory devices. It is used to prepare magnetic films such as read/write heads for disk drives and magnetic layers for magnetic memories.
  4. Other applications: The material is also used to prepare conductive coatings, anti-corrosion coatings and other functional coatings. It has a wide range of uses in research and applications in electronics, optics, materials science and other fields.

Nickel Gallium Sputtering Target Packaging

Our Nickel Gallium Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.

Get Contact

SAM’s Nickel Gallium Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high-purity physical vapour deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapour deposition (CVD), and physical vapour deposition (PVD) display and optical applications.