(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST1003 Tin Silver Sputtering Target, Sn-Ag

Chemical Formula Sn-Ag
Catalog No. ST1003
CAS Number
Purity 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape Discs, Plates, Column Targets, Step Targets, Custom-made

Leveraging extensive materials science expertise, Stanford Advanced Materials (SAM) introduces Tin Silver Sputtering Targets, renowned for their outstanding purity. Our dedication involves providing customized solutions and competitive pricing to meet the precise demands of nanotechnology and thin-film deposition, reflecting SAM’s commitment to excellence in materials engineering.


Tin Silver Sputtering Target Description

Tin Silver Sputtering Target is a material used in the sputtering deposition process. Sputtering is a widely used technique in thin film deposition, where atoms or ions are ejected from a solid target material and deposited onto a substrate to form a thin film.

Tin Silver Sputtering Target is often used in electronic applications, particularly in the manufacturing of solder alloys. The addition of silver to tin improves the mechanical properties, such as strength and ductility, of the solder, making it suitable for joining electronic components.

Related Product: Tin Zinc Sputtering Target, Tin Sputtering Target

Tin Silver Sputtering Target Specifications

Compound Formula Sn-Ag
Molecular Weight 226.5
Appearance Silver Metallic Target
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Tin Silver Sputtering Target Handling Notes

  1. Indium bonding is recommended for the Tin Silver Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
  2. This material has a low thermal conductivity and is susceptible to thermal shock.

Tin Silver Sputtering Target Application

  1. Electronic Manufacturing: Tin Silver Sputtering Targets play a crucial role in electronic manufacturing, contributing to the production of high-performance electronic devices due to their desirable electrical conductivity.
  2. Semiconductor Manufacturing: These targets find significant applications in semiconductor manufacturing, contributing to the creation of efficient and reliable semiconductor components.
  3. Coating Production: Tin Silver Sputtering Targets are instrumental in thin-film deposition processes, ensuring the production of precise and uniform coatings, essential for various industrial and research applications.
  4. Nanotechnology Applications: The targets showcase versatility in nanotechnology applications, reflecting their adaptability and relevance in cutting-edge technologies.

Tin Silver Sputtering Target Packaging

Our Tin Silver Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.

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SAM’s Tin Silver Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high-purity physical vapour deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapour deposition (CVD), and physical vapour deposition (PVD) display and optical applications.