(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA
(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

ST0978 Manganese Tin Sputtering Target, MnSn

Chemical Formula MnSn
Catalog No. ST0978
CAS Number
Purity 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape Discs, Plates, Column Targets, Step Targets, Custom-made

Stanford Advanced Materials (SAM) provides high-quality, cost-effective Manganese Tin Sputtering Targets. Renowned for excellence, our targets meet industry standards and offer a reliable solution for thin film deposition. SAM’s competitive prices make these sputtering targets an ideal choice for various high-tech applications.


Manganese Tin Sputtering Target Description

Manganese Tin Sputtering Targets are distinguished by their exceptional performance in the semiconductor and electronics industries. Renowned for outstanding electrical properties, these targets prove ideal for thin film deposition processes, ensuring reliable and efficient electronic component manufacturing. The alloy, composed of manganese and tin, contributes to their remarkable chemical stability, ensuring steadfastness throughout thin film preparation. The unique combination of manganese and tin alloys not only imparts excellent chemical stability but also offers adjustable physical properties. This versatility makes Manganese Tin Sputtering Targets adaptable to diverse thin film deposition applications, supporting advancements in electronics, semiconductors, and various high-tech industries. With precise control over physical properties, these targets play a crucial role in enhancing the performance and functionality of thin film applications across a broad spectrum of technological applications.

Related Product: Manganese Sputtering Target, Manganese Oxide Sputtering Target

Manganese Tin Sputtering Target Specifications

Compound Formula MnSn
Appearance Grey Target
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Manganese Tin Sputtering Target Handling Notes

  1. Indium bonding is recommended for the Manganese Tin Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
  2. This material has a low thermal conductivity and is susceptible to thermal shock.

Manganese Tin Sputtering Target Application

  1. Semiconductor Manufacturing: Due to their excellent electrical properties, Manganese Tin Sputtering Targets are widely used in the semiconductor industry for thin film deposition, supporting the efficient preparation of electronic components and integrated circuits.
  2. Magnetic thin film preparation: The alloy combination of manganese and tin makes these targets excellent in preparing magnetic thin films for applications in magnetic storage, sensors and magnetic devices.
  3. Electronic device manufacturing: In the production of electronic devices, Manganese Tin Sputtering Targets are widely used for the preparation of thin films to improve the performance and stability of electronic components.
  4. Optical applications: These targets play a key role in the preparation of optical coatings for the production of films with special optical properties, such as filters and lenses.

Manganese Tin Sputtering Target Packaging

Our Manganese Tin Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.

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SAM’s Manganese Tin Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high-purity physical vapour deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapour deposition (CVD), and physical vapour deposition (PVD) display and optical applications.