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(949) 407-8904 Mon - Fri 08:00 - 17:00 23661 Birtcher Dr., Lake Forest, California, USA

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aluminum sputtering target
magnetron sputtering
Target magnetic field The cathode operating voltage of magnetron sputtering decreases as the target surface magnetic field increases, and also decreases as the sputtering etch groove of the target surface deepens. The sputtering current increases as the sputter etch bath of the target surface deepens because the sputter etched surface of the target gets closer...
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Target Material
Purity Purity is one of the main performance indexes of target materials because the purity of target materials has a great influence on the performance of thin films. However, the purity requirements of target materials are not the same in practical application. For example, with the rapid development of the microelectronics industry, the size of...
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The Sputtering Target
Semiconductor materials can be divided into wafer materials and packaging materials. Compared with wafer manufacturing materials, packaging materials have relatively low technical barriers, so we mainly talk about wafer manufacturing materials. The production of wafer mainly involves 7 kinds of semiconductor materials and chemicals, each of which accounts for the following proportion in the semiconductor...
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